Connector and semiconductor device packages employing the same

Details Connector and semiconductor device packages employing the same Connector and semiconductor device packages employing the same

1987-09-16

1990-03-13

Hille, Rolf

357 80, 357 28, H01L 3902, H01L 2302

Patent

active

049086960

ABSTRACT:
The present invention relates to a connector structure for soldering a wiring substrate such as a ceramic wiring substrate to a connector provided on a printed board and also pertains to semiconductor device packages using the same. It is an object of the present invention to provide a connector structure which provides highly reliable electrical connection, together with semiconductor device package using the same. The object is attained by soldering a ceramic wiring substrate to a connector which involves a heater.

REFERENCES:
patent: 3440407 (1969-04-01), Goltsos et al.
patent: 3551645 (1970-12-01), Stoll
patent: 4082394 (1978-04-01), Gedney et al.
patent: 4257061 (1981-03-01), Chapel, Jr. et al.
patent: 4374316 (1983-02-01), Inamori et al.
patent: 4561006 (1985-12-01), Currie
patent: 4667219 (1987-05-01), Lee et al.
Burry et al., IBM Technical Disclosure Bulletin, vol. 19, No. 8, Jan. 1977, "Multidirectional Expansion Packaging".

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