Connector

Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – With provision to conduct electricity from panel circuit to...

Reexamination Certificate

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Reexamination Certificate

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07465171

ABSTRACT:
Contact portions of a socket contact and a header contact are pressed and thinned, and sloping steps formed by the process that presses and thins in the socket contact and the header contact are engaged with each other to suppress disengagement of the contacts.

REFERENCES:
patent: 6019613 (2000-02-01), Kataoka et al.
patent: 6905345 (2005-06-01), Zhang
patent: 7195495 (2007-03-01), Takano et al.
patent: 2006/0051988 (2006-03-01), Okura et al.
patent: 2006/0234525 (2006-10-01), Ookura
patent: 2007/0105408 (2007-05-01), Ookura
patent: 2007/0161274 (2007-07-01), Tanaka et al.
patent: 2007-80843 (2007-03-01), None
English language Abstract of JP 2007-80843.
U.S. Appl. No. 12/059,147 to Miyazaki et al, which was filed on Mar. 31, 2008.

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