Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – With provision to conduct electricity from panel circuit to...
Reexamination Certificate
2008-03-31
2008-12-16
Leon, Edwin A. (Department: 2833)
Electrical connectors
Preformed panel circuit arrangement, e.g., pcb, icm, dip,...
With provision to conduct electricity from panel circuit to...
Reexamination Certificate
active
07465171
ABSTRACT:
Contact portions of a socket contact and a header contact are pressed and thinned, and sloping steps formed by the process that presses and thins in the socket contact and the header contact are engaged with each other to suppress disengagement of the contacts.
REFERENCES:
patent: 6019613 (2000-02-01), Kataoka et al.
patent: 6905345 (2005-06-01), Zhang
patent: 7195495 (2007-03-01), Takano et al.
patent: 2006/0051988 (2006-03-01), Okura et al.
patent: 2006/0234525 (2006-10-01), Ookura
patent: 2007/0105408 (2007-05-01), Ookura
patent: 2007/0161274 (2007-07-01), Tanaka et al.
patent: 2007-80843 (2007-03-01), None
English language Abstract of JP 2007-80843.
U.S. Appl. No. 12/059,147 to Miyazaki et al, which was filed on Mar. 31, 2008.
Miyazaki Yoji
Okura Kenji
Greenblum & Bernstein P.L.C.
Leon Edwin A.
Panasonic Electric Works Co., Ltd.
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