Connection to a component for use in an electronics assembly

Metal fusion bonding – Process – Plural joints

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Details

228246, 228 563, B23K 112, B23K 3514, B23K 3522

Patent

active

049038893

ABSTRACT:
A connection to a contact on an electronic component is made by means of a solder preform in the form of a columm, which comprises a solder body at least partially enclosed within a tubular support. The preform is positioned such that its longitudinal axis is approximately parallel to the plane of the contacts at the point at which it is connected thereto.

REFERENCES:
patent: 4354629 (1982-10-01), Grassauer et al.
patent: 4402450 (1987-09-01), Abraham et al.
patent: 4661887 (1987-04-01), Lin
patent: 4705205 (1987-11-01), Allen et al.
patent: 4712721 (1987-12-01), Nole et al.

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