Connection terminal and a semiconductor device including at...

Details Connection terminal and a semiconductor device including at... Connection terminal and a semiconductor device including at...

2005-06-21

2005-06-21

Zarroli, Michael C. (Department: 2839)

Electrical connectors

Preformed panel circuit arrangement, e.g., pcb, icm, dip,...

With provision to conduct electricity from panel circuit to...

C439S884000, C438S689000

Reexamination Certificate

active

06908311

ABSTRACT:
A first protection film (3) and a second protection film (4) are formed on an electrode pad (2). Bumps (5) are formed at sites where the deposited first and second protection films (3), (4) are both removed. The openings (3a) where the lower, first protection film (3) is removed are larger than the openings (4a) where the upper, second protection film (4) is removed, so that the upper, second protection film (4) has an overhanging structure. The bottom periphery of the bump (5) is formed to extend under the second protection film (4).

REFERENCES:
patent: 6022751 (2000-02-01), Shindo et al.
patent: 6475897 (2002-11-01), Hosaka
patent: 2001/0046011 (2001-11-01), Yasukawa
patent: 260360/1987 (1987-11-01), None
patent: 293671/1987 (1987-12-01), None
patent: 164343/1988 (1988-07-01), None
patent: 305532/1988 (1988-12-01), None
patent: 209725/1991 (1991-09-01), None
patent: 047768/1993 (1993-02-01), None
patent: 198530/1993 (1993-08-01), None
patent: 264541/1996 (1996-10-01), None
patent: 270386/1998 (1998-10-01), None

Affiliated with

Also associated with

Rating

Connection terminal and a semiconductor device including at... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Connection terminal and a semiconductor device including at..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Connection terminal and a semiconductor device including at... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3487741