Connection structure utilizing a metal bump and metal bump manuf

Details Connection structure utilizing a metal bump and metal bump manuf Connection structure utilizing a metal bump and metal bump manuf

1997-05-02

2000-07-25

Fahmy, Wael

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Bump leads

257748, 257772, 257778, H01L 2328

Patent

active

060939648

ABSTRACT:
A metal bump structure constituted by forming a second metal layer on a first metal layer is used which meets the conditions that the first metal layer is not melted at the time of reflow heating for connecting a substrate with a semiconductor chip and the second metal layer is made of a metal producing no composition causing the reliability to deteriorate between the second metal layer and a solder portion formed on the substrate at the time of reflow heating for connecting the substrate with the semiconductor chip.

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Applicants Admitted Prior Art (Figure 2).

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