Connection structure of flexible substrate

Details Connection structure of flexible substrate Connection structure of flexible substrate

2008-01-03

2010-06-01

Lam, Cathy (Department: 1794)

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

C174S0720TR, C174S261000, C361S749000, C361S760000, C361S776000

Reexamination Certificate

active

07728233

ABSTRACT:
In the case of connecting a flexible substrate to a counterpart substrate by soldering, the area of a dead space on the counterpart substrate due to being covered with the flexible substrate is reduced to reduce the outside dimension of the counterpart substrate. Solder lands61and62on the flexible substrate5are soldered to solder lands21and22on the counterpart substrate1. The flexible substrate5is divided into two branching pieces71and72by an incision7or a slit8formed in such a manner as to extend from an intermediate part in the arrangement direction R of circuit patterns to the leading end of the flexible substrate. The space between the solder lands61and62on the respective pieces71and72is made equal to the space between the two spaced-apart solder lands21and22on the counterpart substrate1by placing the pieces71and72formed by dividing the flexible substrate5on one another.

REFERENCES:
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patent: 3808505 (1974-04-01), Reimer
patent: 4000558 (1977-01-01), Cahill
patent: 4587719 (1986-05-01), Barth
patent: 5250758 (1993-10-01), Fjelstad et al.
patent: 6822168 (2004-11-01), Klesing et al.
patent: 2-201992 (1990-08-01), None
patent: 5-067478 (1993-03-01), None

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