Connection structure of circuit substrate

Details Connection structure of circuit substrate Connection structure of circuit substrate

2008-05-13

2008-05-13

Nguyen, Khiem (Department: 2839)

Electrical connectors

Preformed panel circuit arrangement, e.g., pcb, icm, dip,...

With provision to conduct electricity from panel circuit to...

C439S885000

Reexamination Certificate

active

10877752

ABSTRACT:
The present invention provides an improved connection for circuit substrates. The circuit substrates are connected at concave and convex portions at their ends. The concave portion is formed such that the inside width is larger than the entrance width. The convex portion fits into the concave portion. Thereby, a connected portion of the circuit substrates has increased tensile strength. Furthermore, abnormality of the connected portion of the circuit substrates may be easily perceived.

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English language abstract of Japanese Publication No. 09-012228.
English language abstract of Japanese Publication No. 09-191021.
English language abstract of Japanese Publication No. 2000-126665.
English language abstract of Korean Publication No. 1020010097634.
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English language abstract of Korean Publication No. 1998-020175.
English language abstract of Korean Publication No. 20-0271836.
English language abstract of Japanese Publication No. 7-165260.

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