Connection structure of a covered wire with resin encapsulation

Details Connection structure of a covered wire with resin encapsulation Connection structure of a covered wire with resin encapsulation

1997-10-23

1999-12-21

Bradley, Paula

Electrical connectors

Metallic connector or contact having part permanently...

174 84R, 29872, H01R 402

Patent

active

060041706

ABSTRACT:
A covered wire connection structure is formed by the steps of: pinching a covered wire with a pair of resin chips; pressing and exciting a cover portion of the wire by ultrasonic vibration so as to conductively connect conductive portions of both the covered wires at the connection portion; and melting a pair of the resin chips so as to seal the connection portion. The resin chip comprises main melting portions for pinching the connection portion which are melted to a mating resin chip so as to seal the connection portion, and auxiliary melting portions which are formed of material compatible with the cover portion of the covered wire introduced from the main melting portions and pinch the cover portion such that they are melted to the mating resin chip. The auxiliary melting portions and cover portion of the covered wire are melted together and integrated so as to seal an introductive portion of the covered wire from the resin chips. As a result, a reliability in connecting the covered wires by ultrasonic vibration is maintained and waterproofness in the connection portion is improved.

REFERENCES:
patent: 3842487 (1974-10-01), Hartz
patent: 4878969 (1989-11-01), Janisch
patent: 5191710 (1993-03-01), Fujimaki et al.
patent: 5584122 (1996-12-01), Kato et al.
patent: 5857259 (1999-01-01), Johnston
patent: 5869784 (1999-02-01), Shinchi

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