Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Device held in place by clamping
Patent
1996-11-29
1999-03-16
Saadat, Mahshid
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
Device held in place by clamping
257780, 257781, 257778, H01L 2334
Patent
active
058834320
ABSTRACT:
A connection structure for producing both an electrical and a mechanical connection between an electrode pad on a semiconductor device and a printed circuit pattern on a printed circuit board includes a metal bump or a plating layer formed on the printed circuit pattern on the printed circuit board and/or on the electrode pad on the semiconductor device. The semiconductor device is connected to the printed circuit board using cold welding, compression bonding, or a combination of both in conjunction with sandwich materials. The semiconductor device can be separated from the printed circuit board without destroying the semiconductor device or the printed circuit board by releasing the pressure applied to the sandwich materials. Therefore, the semiconductor device can be removed from the printed circuit board to make necessary repairs and/or exchange parts, and then reconnected to the printed circuit board.
REFERENCES:
patent: 5311402 (1994-05-01), Kobuyashi et al.
patent: 5436503 (1995-07-01), Kunitomo et al.
Clark S. V.
Ricoh & Company, Ltd.
Saadat Mahshid
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