Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package
Reexamination Certificate
2002-07-18
2004-09-28
Flynn, Nathan J. (Department: 2826)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
C257S723000, C361S758000
Reexamination Certificate
active
06798051
ABSTRACT:
BACKGROUND OF THE INVENTION
Field of the Invention
The invention relates to the problem of mounting packages that hold integrated semiconductor chips on an electronic printed circuit board.
Electronic circuits that cannot be fabricated entirely on a single semiconductor chip as an integrated microelectronic circuit include electronic and microelectronic components that are disposed on a printed circuit board as a carrier and are connected to one another by interconnects running on the printed circuit board. The electronic components are, for example, passive components such as resistors or capacitors; more complex components, on the other hand, are produced as microelectronic integrated semiconductor circuits that are held in a package with external terminals and are mounted on the printed circuit board. When there are a large number of electronic circuits, a number of such packaged microelectronic semiconductor circuits are disposed on one printed circuit board. For instance, memory modules or other complex circuits, such as, for example, embedded DRAMs, always have a number of microelectronic semiconductor chips disposed on the printed circuit board.
In view of progressive miniaturization, both of the electronic circuit and of the microelectronic integrated circuits themselves, with every circuit to be developed there newly arises the problem of configuring the individual elements of the circuit as compactly as possible. Furthermore, a newly developed circuit is intended to perform as well as possible and be as versatile as possible, which is best achieved by a large part of the electrical operations being executed by the microelectronic integrated semiconductor circuits.
A new integrated semiconductor chip cannot be independently produced for every electric circuit to be developed. It is rather the case that, for reasons of cost, the further technical development of semiconductor chips is proceeding independently of the further development of macroscopic electronic circuits, realized, for instance, on printed circuit boards. Therefore, to perform complex tasks by way of circuit engineering, as many commercially available semiconductor chips as possible are disposed on a printed circuit board. The desire for great versatility and performance capability of the electronic circuit, with at the same time compactness of the printed circuit board, leads to the necessity for as many integrated memory chips as possible to be disposed in a confined space next to one another on the printed circuit board.
Every newly developed configuration of commercially available semiconductor memory chips on a printed circuit board has great effects on the routing of the interconnects on the printed circuit board and requires corresponding expenditure to be invested in the construction of the interconnect routing. At the same time, there are always specifications to be observed regarding the length of typically several hundred interconnects, regarding the thicknesses of the interconnects and regarding the distances between different components. These specifications, compliance with which is required for the technical functional capability of an electronic circuit, greatly restrict the possibilities for the configuration of the electronic and microelectronic components on the printed circuit board. The microelectronic semiconductor chips in particular, which are always held in a package that typically has several dozen to several hundred contact terminals disposed in rows, are difficult to integrate in a circuit layout due to the prescribed configuration of their external terminals.
In particular, in the case of circuits to be newly developed that are sold in small numbers, and, therefore, only allow limited expenditure on construction, the difficulty of integrating microelectronic semiconductor chips represents a particular hurdle.
SUMMARY OF THE INVENTION
It is accordingly an object of the invention to provide a connection of packaged integrated memory chips to a printed circuit board that overcomes the hereinafore-mentioned disadvantages of the heretofore-known devices of this general type and that facilitates the integration of a number of microelectronic semiconductor chips in an electronic circuit to be disposed on a printed circuit board, and, in particular, to dispose integrated semiconductor chips on a single printed circuit board, specifically, in relatively large numbers and, at the same time, in a confined space.
With the foregoing and other objects in view, there is provided, in accordance with the invention, an interface unit for an electronic circuit, the interface unit including an interface body having first electrical contacts for electrically and mechanically connecting the interface body to the printed circuit board, second electrical contacts for electrically and mechanically connecting the interface body to at least one package with an integrated semiconductor chip, and the first electrical contacts electrically connected to the second electrical contacts.
According to the invention, an interface unit that is disposed between the printed circuit board and one or more packaged semiconductor chips and can be connected to both is proposed. With the aid of such an interface unit, more versatile and flexible electrical-mechanical connections can be established between microelectronic integrated semiconductor chips and a printed circuit board.
Conventionally, every integrated, packaged semiconductor chip is electrically and mechanically connected directly to the printed circuit board through the contacts of its package. With the interface units according to the invention, an intermediate level is introduced into such a connection, making it possible for the packaged semiconductor chips to be adapted both to changing contact configurations of the printed circuit board and to different electrical operating parameters on the part of the electronic circuit produced on the printed circuit board. This significantly increases the flexibility of the circuit construction; circuit layouts that were previously technically unfeasible are no longer hindered by the specified configuration of commercially available circuit packages, but, instead, can be realized both by the construction of the interface units according to the invention and by their configuration on the printed circuit board. The invention makes a much more varied integration of integrated semiconductor chips possible in large numbers in a confined space on electronic printed circuit boards and lowers the expenditure and costs for the production of electronic circuits.
In accordance with another feature of the invention, the second electrical contacts are formed at the same time as second mechanical connecting device. The interface unit must be connected to the packages of the integrated semiconductor chips; this connection must be produced mechanically and electrically. It keeps costs down if mechanical connections are configured simultaneously as electrical connections, and vice-versa. Many electrical contacts—generally at least several dozen—are required between an interface unit and a packaged integrated semiconductor chip in order to link the integrated semiconductor circuit to the electronic circuit surrounding it. If these electrical contacts, already high in number, are used at the same time for the mechanical connection of the interface unit to an integrated semiconductor chip, there is no need for otherwise required separate mechanical connecting device. The interface unit and the package of the integrated semiconductor chip can, therefore, be configured more simply.
In accordance with another feature of the invention, the first electrical contacts are pin contacts.
In accordance with a further feature of the invention, the second electrical contacts of the interface unit are formed as elements for a mechanical plug-in connection. A plug-in connection between integrated semiconductor chips and interface units makes simple, low-cost and rapid mounting possible. Such a connection is advantageous even when the integrated sem
Benedix Alexander
Düregger Reinhard
Hermann Robert
Andújar Leonardo
Flynn Nathan J.
Greenberg Laurence A.
Infineon - Technologies AG
Mayback Gregory L.
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