Connection of integrated circuit to a substrate

Details Connection of integrated circuit to a substrate Connection of integrated circuit to a substrate

2005-07-12

2005-07-12

Nasri, Javaid H. (Department: 2839)

Electrical connectors

Preformed panel circuit arrangement, e.g., pcb, icm, dip,...

Distinct contact secured to panel circuit

Reexamination Certificate

active

06916185

ABSTRACT:
The present invention provides a method of connecting an integrated circuit to a substrate and a corresponding circuit arrangement. Connecting occurs by performing the steps of: providing a main area (HF1) of the integrated circuit (1), which has an electrical contacting region (2), with a mechanical supporting structure (3a, 3b; 33a, 33b, 33c; 43a, 43b, 43c); providing a solderable surface region (5a, 5b; 35a, 35b, 35c; 60a, 60b, 60c) of the mechanical supporting structure (3a, 3b; 33a, 33b, 33c; 43a, 43b, 43c); providing a solderable terminal region (10; 5, 30; 40, 50), which is electrically connected to the electrical contacting region (2), on the main area (HF1) of the integrated circuit (1); providing a main area (HF2) of the substrate (20) with a first soldering region (22′, 23′; 22′, 23′, 22″, 23″), which can be aligned with the solderable surface regions (5a, 5b; 35a, 35b, 35c; 60a, 60b, 60c), and with a second soldering region (22, 23), which can be aligned with the solderable terminal region (10; 5, 30; 40, 50); and simultaneous soldering of the surface regions (5a, 5b; 35a, 35b, 35c; 60a, 60b, 60c) to the first soldering region (22′, 23′; 22′, 23′, 22″, 23″) and of the terminal region (10; 5, 30; 40, 50) to the second soldering region (22, 23).

REFERENCES:
patent: 5056215 (1991-10-01), Blanton
patent: 5400950 (1995-03-01), Myers et al.
patent: 5448114 (1995-09-01), Kondoh et al.
patent: 5598036 (1997-01-01), Ho
patent: 5633535 (1997-05-01), Chao et al.
patent: 5796169 (1998-08-01), Dockerty et al.
patent: 19702186 (1997-01-01), None

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