Connection of electrically conducting layers with ceramic promin

Details Connection of electrically conducting layers with ceramic promin Connection of electrically conducting layers with ceramic promin

1994-12-21

1998-10-27

Ledynh, Bot L.

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

361790, 156 89, H01R 909

Patent

active

058280103

DESCRIPTION:

BRIEF SUMMARY
STATE OF THE ART

The invention relates to the connection of electrically-conducting layers of a layer system wherein the electrically conducting layers extend in at least two layer levels or planes between which at least one ceramic foil is arranged, and wherein a through connection or contact between the conductors of one layer level or plane to those of the other layer level or plane extends or has been cut through the ceramic foil. In addition to electronic circuits, layered structures which are created by imprinting, stacking and laminating ceramic foils are increasingly employed in sensor technology, for example with gas sensors. With such laminated structures it is often necessary to connect conducting layers, for example strip conductors, through a ceramic foil to the next following foil. To connect strip conductors through a ceramic foil, it is customary to fill connecting holes (vias), which are either stamped, drilled or created by a laser, completely or partially with an electrically conductive paste. The continuous electrical connection is created where a strip conductor extends at this point on the next following foil, if both foils are laminated so they are accurately fitted with an even surface pressure. However, since ceramic foils can be plastically deformed, the material of the ceramic foils yields in the area of the edges and the connecting hole, so that the laminating pressure is reduced in this area.
The end result of this is that following sintering it is possible that the laminated bond between the two ceramic foils as well as the electrical connection can be disrupted at the place of the connecting hole or is interrupted by alternating thermal stresses.


SUMMARY AND ADVANTAGES OF THE INVENTION

The above discussed problem according to the prior art is overcome according to the present invention by a connection arrangement of electrically conducting layers extending in at least two layer levels or planes, between which at least one ceramic foil is arranged, wherein a connection between the one layer level to the other layer level has been cut through the ceramic foil, and a contact point, which is located outside the connection, is provided in at least one layer level.
In contrast to one prior art, the connection in accordance with the invention has the advantage that a permanent electrical connection is maintained during operation, for example with alternating thermal stress, even after sintering of the layer system. The contact point has been placed into the area of a defined lamination pressure, so that following sintering a homogeneous laminated bond between the two ceramic foils is created.
Advantageous further embodiments and features of the basic connection according to the invention are possible are disclosed. A particularly good electrical connection is achieved when both layers to be connected each have a raised surface at the contact point so that a snap fastener-like connection is created.


BRIEF DESCRIPTION OF THE DRAWINGS

An exemplary embodiment of the invention is shown in the drawings and explained in detail in the subsequent description. FIG. 1 shows a layer system in accordance with the state of the art with an electrical connection between two strip conductors after sintering, FIG. 2a shows a first foil of a layer system with a connecting point formed, FIG. 2b shows a second ceramic foil, also with a connecting point, and associated with the first ceramic foil in accordance with FIG. 2a, and FIG. 3 shows the ceramic foils of FIGS. 2a and 2b in the laminated and sintered state.


DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

A layer system with a connection in accordance with the state of the art is shown in FIG. 1, wherein the layer system consists of a first ceramic foil 10 and a second ceramic foil 20. A first strip conductor 11 is arranged on the first foil 10 as the electrically conducting layer. A hole 12 is provided in the foil 10, through which a connection 13 is guided which connects the first strip conductor 11 with a second strip conductor 21, wh

REFERENCES:
patent: 4555285 (1985-11-01), Chance et al.
patent: 4847003 (1989-07-01), Palanisamy
patent: 5245135 (1993-09-01), Schreiber et al.
patent: 5587885 (1996-12-01), Swamy
IBM Technical Disclosure Bulletin, vol. 22, No. 2, Jul., 1979, "Low-Cost Stacked Module", Rasile et al., pp. 525-526.

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