Connection of active circuitry via wire bonding procedure

Details Connection of active circuitry via wire bonding procedure Connection of active circuitry via wire bonding procedure

1997-12-16

1999-04-06

Ngo, Ngan V.

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Of specified material other than unalloyed aluminum

257774, 257784, 257786, H01L 2348, H01L 2352, H01L 2940

Patent

active

058922830

ABSTRACT:
A method of fabricating a bond and the bond. The process includes providing a lower level (M1,13, 15) of electrically conductive metal disposed on a substrate having a pair of spaced apart sections. An electrically insulating layer (11) is then disposed over the lower level and vias (23) are formed in the electrically insulating layer, individual ones of the vias extending to one of the spaced apart section of the lower level. An upper level of electrically conductive metal (M2, 17, 19) is disposed on the electrically insulating layer, the upper level having a pair of spaced apart sections, each coupled to one of the sections of the lower level through a via. One of the pair of spaced apart sections of the lower level is preferably essentially U-shaped (13) and the other section (15) of the lower level is essentially rectangular shaped and extends into the open end of the "U". One of the pair of spaced apart section of the upper level is essentially rectangular (17) with a rectangular aperture at its central region and the other section of the upper level (19) is essentially rectangular and disposed within the rectangular aperture. A bond (23) is formed completely enclosing the spaced apart sections of the upper level.

REFERENCES:
patent: 5010389 (1991-04-01), Gahsauge et al.
patent: 5381105 (1995-01-01), Phipps
patent: 5451810 (1995-09-01), Tigelaar et al.
patent: 5742094 (1998-04-01), Ting

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