Connection method and connection device for electrical connectio

Details Connection method and connection device for electrical connectio Connection method and connection device for electrical connectio

1993-10-06

1994-07-12

Bradley, P. Austin

Metal fusion bonding

Process

Plural joints

228205, 228217, 2282481, 427 99, H01L 2160, B23K 3102

Patent

active

053280784

ABSTRACT:
A first portion is set near or in contact with a second portion. The first and second portions are electrically connected by spraying fine metal particles particles of gold, nickel or copper in a carrier gas of helium, argon, hydrogen or nitrogen on the first and second portions to form a metal bump. Prior to spraying the fine metal particles to form the metal bump, hard particles of titanium, copper, hafnium, zirconium or vanadium may be sprayed on the first and second portions to remove contamination layers.

REFERENCES:
patent: 3116549 (1964-01-01), Born et al.
"Abrasive Blast Cleaning," Metals Handbook, 9th Ed., vol. 5, 1982, pp. 83-86.
Patent Abstract of Japanese Publication No. JP1084738 dated Mar. 30, 1989.
Patent Abstract of Japanese Publication No. JP3046395 dated Feb. 27, 1991.
Patent Abstract of Japanese Publication No. JP55067133 dated May 21, 1980.
European Patent Office Search Report for Application No. 91122420.2 dated Oct. 9, 1992.

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