Connection construction and method of manufacturing the same

Details Connection construction and method of manufacturing the same Connection construction and method of manufacturing the same

1989-03-06

1990-10-16

Miller, Stanley D.

350343, 350344, G02F 113

Patent

active

049630024

ABSTRACT:
A connection construction is provided for connecting a first conductor provided on a first member such as a semiconductor driving device to a second conductor provided on a second member such as a liquid crystal display device driven by the semiconductor driving device, the connection construction including a conductive adhesive deposited on the first conductor, a conductive particle bonded with the conductive adhesive and partly protruding toward the second conductor disposed opposite thereto, and an electrically insulating adhesive for bonding the first member to the second member with the conductive particle contacting the second conductor. The first conductor and the second conductor are electrically connected via the conductive particle, and the first member and the second member are mechanically connected with the electrically insulating adhesive. Thus, a semiconductor driving device (LSI) is, for example, directly connected to a transparent substrate of a liquid crystal display device. Also, when an electrically insulating adhesive is used for bonding the conductive particle, the conductive particle is bonded to contact the first conductor.

REFERENCES:
patent: 4386293 (1983-05-01), Waldron
patent: 4640581 (1987-02-01), Nakanowatari et al.
patent: 4655551 (1987-04-01), Washizuka et al.
patent: 4721365 (1988-01-01), Nishimura
patent: 4832455 (1989-05-01), Takeno et al.
Nikkei Microdevices, Jun. 1987, p. 69.

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