Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead
Patent
1998-04-08
1999-09-28
Williams, Alexander Oscar
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
257 48, 257620, 257696, 257698, 257691, 257202, 257203, 257208, 257210, H01L 2312, H01L 2348, H01L 2336
Patent
active
059593547
ABSTRACT:
A connection component for a microelectronic element includes a sheet-like support structure having top and bottom surfaces which extend in horizontal directions. The support structure includes a central region and a periphery surrounding the central region with terminals mounted on the central region of the support structure and exposed at the top surface thereof. A plurality of leads extend on the support structure with each lead having a terminal section connected to one of the terminals and attached to the bottom surface, a bond region and a horizontally curved section between the bond region and the terminal region. The bond regions of the leads are disposed side-by-side in one or more rows adjacent the periphery of the support structure. After the bond regions of the leads have been bonded to contacts of a microelectronic element, the support structure of the connection component is moveable upwardly so as to bend the curved sections of the leads.
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DiStefano Thomas H.
Smith John W.
Tessera Inc.
Williams Alexander Oscar
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