Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor
Patent
1998-01-16
1999-05-18
Niebling, John F.
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
H01L21/44;21/48;21/50
Patent
active
059044985
ABSTRACT:
A connection component for a microelectronic device such as a semiconductor chip incorporates a dielectric layer and leads extending across a surface of the dielectric layer. Each lead has one end permanently fastened to the dielectric layer and another end releasably bonded to the dielectric layer. The releasable end is held in place by a bond having a relatively low peel strength, desirably less than about 0.35.times.10.sup.6 dynes/cm.
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Jones Joseph I.
Niebling John F.
Tessera Inc.
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