Connection board, and multi-layer wiring board, substrate...

Metal working – Method of mechanical manufacture – Electrical device making

Reexamination Certificate

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C029S842000, C029S852000

Reexamination Certificate

active

08028402

ABSTRACT:
Disclosed is a manufacturing method of a multi-layer wiring board, which method includes: preparing connection boards, the connection boards having respectively an insulating resin composition layer, a connection conductor formed so as to pass through the insulating resin composition layer and a conductor circuit formed on the insulating resin composition layer and connected to the connection conductor; aligning the connection boards; and laminating the aligned connection boards by heating and pressing, so that the connection conductors, or the connection conductor and the conductor circuit, are conductively connected with each other, and the connection boards are mechanically connected with each other by the insulating resin composition layer. The connection boards are formed by specified processing, including use of a three-layer composite metallic layer.

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Office Action mailed Oct. 17, 2006 in JP 2003-557266.
International Search Report mailed Apr. 15, 2003 for No. PCT/JP02/13434.
Hiroshi Ohira, et al., “Suggestion of Printed Wiring Board by New Manufacturing Method”, A Collection of Papers at the Ninth Lecture Meeting Regarding Circuit Mount, ISSN 0916-0043, 15A-10, pp. 55-56, (Mar. 14-16, 1995).
Takahiro Mori, et al., “Application and Miniaturization of Substrate Using Inter-Layer Connection Technique Using Bump”, A Collection of Papers at the Tenth Lecture Meeting Regarding Circuit Mount ISSN 0916-0043, 15A-09, pp. 79-80, (Mar. 13-15, 1996).

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