Connection between a semiconductor housing and a base plate...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Device held in place by clamping

Reexamination Certificate

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Details

C257SE23086, C257SE23083, C257S731000

Reexamination Certificate

active

07932598

ABSTRACT:
A semiconductor module has a housing (2) and a metal base plate (3). A reliable yet easily producible force-transmitting connection between a semiconductor module and an external heat sink is provided by a mechanical pressure-proof counterpart (4) which is incorporated into the housing (2) and forms a firm connection (14) with a pressure-proof connecting element (10) on the base plate side. The connection is provided with a passage opening (12) for fastening the semiconductor module to the heat sink.

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International Search Report for PCT/EP2004/005519, 4 pages, Mailing Date Nov. 2, 2004.
International Preliminary Report of Patentability for PCT/EP2004/005519,7 pages, Mailing Date Jan. 12, 2006.

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