Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Device held in place by clamping
Reexamination Certificate
2011-04-26
2011-04-26
Fahmy, Wael M (Department: 2814)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
Device held in place by clamping
C257SE23086, C257SE23083, C257S731000
Reexamination Certificate
active
07932598
ABSTRACT:
A semiconductor module has a housing (2) and a metal base plate (3). A reliable yet easily producible force-transmitting connection between a semiconductor module and an external heat sink is provided by a mechanical pressure-proof counterpart (4) which is incorporated into the housing (2) and forms a firm connection (14) with a pressure-proof connecting element (10) on the base plate side. The connection is provided with a passage opening (12) for fastening the semiconductor module to the heat sink.
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Coats & Bennett P.L.L.C.
Fahmy Wael M
Infineon - Technologies AG
Salerno Sarah K
LandOfFree
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