Connection between a semiconductor chip and an external...

Details Connection between a semiconductor chip and an external... Connection between a semiconductor chip and an external...

2007-01-30

2007-01-30

Nhu, David (Department: 2818)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Including adhesive bonding step

C438S455000, C257SE21008, C257S021000

Reexamination Certificate

active

10842259

ABSTRACT:
A conductive connection is made between a semiconductor chip and an external conductor structure. An elevation element is applied on the surface of the semiconductor chip and a soldering island is arranged on the elevation element. An interconnect is produced below the soldering island as far as a bonding island or an I/O pad. Increased reliability of conductive connections of the bonding island or the I/O pad to an external conductive structure can be achieved by preventing the flowing-away of the solder and the oxidation or corrosion of the conductive layer.

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