Electrical connectors – Contact comprising cutter – Insulation cutter
Patent
1991-10-21
1993-09-07
McGlynn, Joseph H.
Electrical connectors
Contact comprising cutter
Insulation cutter
H01R 424
Patent
active
052423131
ABSTRACT:
Electrical connection assembly between a control bundle (25) having n conductors (C.sub.1 -C.sub.n) and at least one branched bundle (30) having n conductors (D.sub.1 -D.sub.n), one at least of the conductors (D.sub.3) of the branched bundle being connected in parallel with one of the conductors (C.sub.3) of the control bundle, and two of the conductors of the branched bundle (D.sub.1 -D.sub.2) being connected in series with one of the conductors (C.sub.2) of the control bundle.
This assembly comprises a first clip (100) for fastening and connection on the control bundle (25), which clip is equipped with at least one contact (F.sub.3) ensuring an electrical contact with the conductor of the control bundle to be connected in parallel, at least one disconnection member (108) for disconnecting the conductor to be connected in series and at least two contacts (F.sub.1,F.sub.2) for ensuring electrical contacts on either side of the disconnection member with the conductor (C.sub.2) to be connected in series.
REFERENCES:
patent: 3924917 (1975-12-01), Munshower
patent: 3956811 (1976-05-01), Munshower
patent: 4263474 (1981-04-01), Tannant
patent: 4564256 (1986-01-01), Damiano et al.
patent: 4668039 (1987-05-01), Marzili
patent: 4674819 (1987-06-01), Fujitani et al.
patent: 4687275 (1987-08-01), Ramisch et al.
patent: 4968267 (1990-11-01), Payne
Logerot Bernard
Pone Remy
Poyet Didier
Amphenol Socapex
McGlynn Joseph H.
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