Connection array for interconnecting hermetic chip carriers to p

Electricity: electrical systems and devices – Miscellaneous

Patent

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Details

174 52FP, 174 685, 361406, 361409, H05K 118

Patent

active

044234678

ABSTRACT:
The invention comprises a connection array for establishing a plurality of electrical connections between circuit pads of a support, such as a circuit board, and contacts of an electrical housing, such as a hermetic chip carrier, wherein the contacts comprise semi-circular vertical indentations in the housing periphery with each indentation having a conductive layer therein. A plurality of pillars, which may be electroplated, extend vertically above the support in an array respectively corresponding to the outline of the indentations with each pillar being connected to different pad of the support and the pillars having dimensions to permit at least partial entry into the indentations whereby solder may be introduced between the pillars and associated conductive layers to establish visible and inspectable electrical connections therebetween.

REFERENCES:
patent: 2771663 (1956-11-01), Henry
patent: 2971138 (1961-02-01), Meisel
patent: 3386009 (1968-05-01), Grabbe
patent: 3464855 (1969-09-01), Shaheen et al.
patent: 3500538 (1970-03-01), Raciti
patent: 3781596 (1973-12-01), Galli
patent: 3964087 (1976-06-01), Mallon

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