Connection arrangement with PC board

Details Connection arrangement with PC board Connection arrangement with PC board

1993-10-07

1994-10-11

Tolin, Gerald P.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

174252, 257713, 361719, 428901, H05K 720

Patent

active

053552806

ABSTRACT:
A connection arrangement with PC board features a ceramic substrate glued to a base plate of metal, used as a cooling body. Islands have been hollowed out of the adhesive layer and are filled with thermally conductive paste. Particularly effective thermal dissipation is possible in the area of the islands filled with thermally conductive paste, so that the islands are always disposed underneath components with great energy or heat dissipation.

REFERENCES:
patent: 4383270 (1983-05-01), Schelhorn
patent: 4546410 (1985-10-01), Kaufman
patent: 4709301 (1987-11-01), Yamaguti
patent: 4771365 (1988-09-01), Cichocki
patent: 4796157 (1989-01-01), Ostrem
patent: 4802532 (1989-02-01), Dawes et al.
patent: 4847146 (1989-07-01), Yeh
patent: 4897764 (1990-01-01), Bruchmann
patent: 4979079 (1990-12-01), Morley
patent: 5117069 (1992-05-01), Higgins, III
patent: 5164541 (1992-11-01), Leysseus
"On-Board . . . Printhead", Mizzi, vol. 24, No. 1A, Jun. 1981, p. 284, IBM Tech Discl. Bull.

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