Connection arrangement for superimposed layers of material

Details Connection arrangement for superimposed layers of material Connection arrangement for superimposed layers of material

2006-12-09

2010-02-09

Estremsky, Gary (Department: 3677)

Expanded, threaded, driven, headed, tool-deformed, or locked-thr

Fastener or fastener element composed of plural different...

Core and exterior of different materials

C411S510000

Reexamination Certificate

active

07658583

ABSTRACT:
In aircraft construction, connection elements for connecting layers of insulating material onto walls are subject to special requirements for ease of installation, weight considerations, and resistance to heat. The invention provides a connection arrangement, in particular for superimposed layers of material, whose function is not impaired under extreme heat. The connection arrangement is comprised by a pin with a head or head arrangement, engaging positions, and a retaining element. The pin, the head or the head arrangement, and retaining element are made up of a skeleton and an outer material where the skeleton is made of a material more resistant to heat than the outer material. Following destruction or removal of the outer material by heat, the remaining skeleton parts of the pin, head part, and retaining element maintain their connections and structure keeping the layers of material in place.

REFERENCES:
patent: 309181 (1884-12-01), Woodrich
patent: 1093637 (1914-04-01), Lint
patent: 3266831 (1966-08-01), Banse
patent: 3571977 (1971-03-01), Abeel
patent: 4495380 (1985-01-01), Ryan et al.
patent: 4686783 (1987-08-01), Bourquard et al.
patent: 4805366 (1989-02-01), Long
patent: 4987714 (1991-01-01), Lemke
patent: 5036674 (1991-08-01), Chang
patent: 5217339 (1993-06-01), O'Connor
patent: 5308205 (1994-05-01), Lautenschlager
patent: 5426905 (1995-06-01), Rollhauser et al.
patent: 5529369 (1996-06-01), Welborn
patent: 5626450 (1997-05-01), Ferrari et al.
patent: 5655801 (1997-08-01), Casey
patent: 5782511 (1998-07-01), Schwarz
patent: 6149210 (2000-11-01), Hunt
patent: 6409446 (2002-06-01), Schwarz
patent: 6442806 (2002-09-01), Wesson
patent: 6443679 (2002-09-01), Schwarz
patent: 6497436 (2002-12-01), Deblock
patent: 6679530 (2004-01-01), Krynski
patent: 6736438 (2004-05-01), Wieclawski
patent: 6837661 (2005-01-01), Schwarz et al.
patent: 6846125 (2005-01-01), Smith et al.
patent: 6866227 (2005-03-01), Pratt
patent: 6908144 (2005-06-01), Gotzinger et al.
patent: 7107697 (2006-09-01), Schwarz et al.
patent: 7179039 (2007-02-01), SCHWARZ et al
patent: 7234209 (2007-06-01), Totani et al.
patent: 2002/0017009 (2002-02-01), Smith et al.
patent: 2004/0115030 (2004-06-01), Schwarz
patent: 2004/0240933 (2004-12-01), Schwarz et al.
patent: 2007/0158955 (2007-07-01), Homner
patent: 1860948 (1962-10-01), None
patent: 3145155 (1981-11-01), None
patent: 8710288 (1987-10-01), None
patent: 3623311 (1988-01-01), None
patent: 3922025 (1990-09-01), None
patent: 4239908 (1994-03-01), None
patent: 19707634 (1997-10-01), None
patent: 29808914 (1998-09-01), None
patent: 29914145 (2000-12-01), None
patent: 10040410 (2001-01-01), None
patent: 19943083 (2001-12-01), None
patent: 20218302 (2003-03-01), None
patent: 10355780 (2005-06-01), None
patent: 102004011183 (2005-09-01), None
patent: 102006008655 (2006-09-01), None
patent: 202006019165.8 (2007-08-01), None
patent: 202007000112.6 (2007-08-01), None
patent: 0189569 (1989-02-01), None
patent: 0784141 (1997-07-01), None
patent: 06026133 (2007-03-01), None
patent: 07004742 (2007-05-01), None
patent: 07024364 (2008-06-01), None
patent: 07024365 (2008-06-01), None
patent: 1268022 (1972-03-01), None
patent: 1506902 (1978-04-01), None
patent: 2050487 (1981-01-01), None
patent: 2219342 (1989-12-01), None
patent: 2000310210 (2000-07-01), None
patent: 80/00162 (1980-02-01), None
U.S. Appl. No. 11/950,643, Homner.
U.S. Appl. No. 11/950,630, Homner.
U.S. Appl. No. 11/682,099, Homner.

Affiliated with

Also associated with

Rating

Connection arrangement for superimposed layers of material does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Connection arrangement for superimposed layers of material, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Connection arrangement for superimposed layers of material will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4168942