Metal working – Method of mechanical manufacture – Electrical device making
Reexamination Certificate
2011-07-19
2011-07-19
Banks, Derris H (Department: 3729)
Metal working
Method of mechanical manufacture
Electrical device making
C029S832000, C029S831000, C029S846000, C029S847000, C174S262000
Reexamination Certificate
active
07979983
ABSTRACT:
Techniques for optimizing application specific integrated circuit (ASIC) and other IC pin assignment corresponding to a high density interconnect (HDI) printed circuit board (PCB) layout are provided. Applying the techniques described herein, pin assignments may be systematically and strategically planned, for example, in an effort to reduce the PCB layer count and associated cost, increase signal integrity and speed, reduce the surface area used by an ASIC and its support circuitry, reduce plane perforations, and reduce via crosstalk when compared to conventional designs with an ASIC mounted on a multilayered PCB.
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Bird Steven C.
Duong Phuong Rosalynn
Mazaheri Linda M.
Needham Bob
Banks Derris H
Cisco Technology Inc.
Nguyen Tai
Patterson & Sheridan LLP
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