Joints and connections – Utilizing thermal characteristic – e.g. – expansion or...
Reexamination Certificate
2006-08-15
2006-08-15
Cottingham, John R. (Department: 2116)
Joints and connections
Utilizing thermal characteristic, e.g., expansion or...
C403S029000, C403S030000, C403S271000
Reexamination Certificate
active
07090423
ABSTRACT:
Joint formations that, in joining together joining members employed in a variety of electrical and electronic components, yield sufficiently high joint strength in the direction perpendicular to the plane in which two joining members join, and meanwhile in the direction parallel to the joint plane. First and second joining members have respective joint phases each formed with a different number of distinct yet continuous conformational faces, defining the joint phases so that neither is the matching complement of the other. A bonding agent interposed between the joint phases joins the joining members together. The difference in thermal expansion coefficient between the two joining members, and between them and the bonding agent, is 5.0×10−6/° C. or less. The joining members are a metal such as tungsten or Cu—W, or a ceramic such as AlN or Si3N4; and glass or a solder material is utilized for the bonding agent.
REFERENCES:
patent: 4732047 (1988-03-01), Kato et al.
patent: 5028162 (1991-07-01), Tsuno et al.
patent: 5076484 (1991-12-01), Ito et al.
patent: 5083384 (1992-01-01), Possati et al.
patent: 5104747 (1992-04-01), Makino et al.
patent: 5161908 (1992-11-01), Yoshida et al.
patent: 5163770 (1992-11-01), Soma et al.
patent: 6059483 (2000-05-01), Owens et al.
patent: 6574864 (2003-06-01), Meissner et al.
patent: 6789776 (2004-09-01), Gavin
patent: S53-066910 (1978-06-01), None
patent: S60-0077178 (1985-05-01), None
patent: S60-077180 (1985-05-01), None
patent: H01-176284 (1989-07-01), None
patent: H02-237054 (1990-09-01), None
patent: H03-080162 (1991-04-01), None
patent: 251896 (1996-05-01), None
Kuibira Akira
Nakata Hirohiko
Natsuhara Masuhiro
Cottingham John R.
Judge James W.
Sumitomo Electric Industries Ltd.
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