Connecting structure, printed substrate, circuit, circuit...

Details Connecting structure, printed substrate, circuit, circuit... Connecting structure, printed substrate, circuit, circuit...

2006-06-01

2009-06-30

Richards, N Drew (Department: 2822)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With contact or lead

C257S698000

Reexamination Certificate

active

07554187

ABSTRACT:
A connecting structure between a circuit and another electronic component, includes a first electrode and a second electrode, and a dielectric material interposed between the first and second electrodes.

REFERENCES:
patent: 7012339 (2006-03-01), Terui
patent: 2003/0199121 (2003-10-01), Caletka et al.
patent: 2004/0079193 (2004-04-01), Kokubo et al.
patent: 2004/0184219 (2004-09-01), Otsuka et al.
patent: 2007/0035030 (2007-02-01), Horton et al.
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patent: 2002-353275 (2002-12-01), None
patent: 2004-95804 (2004-03-01), None
patent: 2004-214699 (2004-07-01), None
patent: 2005-45000 (2005-02-01), None
Japanese Office Action dated Nov. 6, 2007 with Partial English Translation.
Japanese Office Action dated Feb. 10, 2009 with partial English-Language Translation.

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