Metal fusion bonding – Process – With protecting of work or filler or applying flux
Reexamination Certificate
2005-11-22
2005-11-22
Stoner, Kiley S. (Department: 1725)
Metal fusion bonding
Process
With protecting of work or filler or applying flux
C174S255000, C257S734000
Reexamination Certificate
active
06966482
ABSTRACT:
Lands formed on a flexible printed circuit board are electrically connected with lands formed on a rigid printed circuit board through solder. At this point, solder resist is formed between neighboring two lands on the rigid printed circuit board, and is terminated with an end portion that is interposed between the rigid printed circuit board and the flexible printed circuit board. Accordingly, even when surplus solder is extruded onto the rigid printed circuit board, the solder resist can prevent solder bridges from being formed between the lands.
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Deguchi Kazuyuki
Miyake Toshihiro
Nakagawa Hajime
Teramae Takehito
Totani Makoto
Denso Corporation
Posz Law Group , PLC
Stoner Kiley S.
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