Connecting structure of electronic part and electronic device us

Details Connecting structure of electronic part and electronic device us Connecting structure of electronic part and electronic device us

1988-09-13

1992-02-04

Hille, Rolf

357 81, 357 68, 357 80, H01L 2336, H01L 2348, H01L 21603

Patent

active

050863371

ABSTRACT:
This invention relates to a connecting structure for electrically connecting an electronic part such as an LSI chip to a substrate, its production method and an electronic device using the former. The present invention is particularly useful for connecting electrically a plurality of chips, for which an absorption function of the difference of thermal expansion in a horizontal direction and capability of displacement in a vertical direction are requisite, to a substrate. Moreover, the connecting structure of the present invention can simplify the fabrication process, has high reliability and can be applied to high performance electronic appliances and apparatuses such as electronic computers.

REFERENCES:
patent: 4607276 (1986-08-01), Butt
patent: 4893172 (1990-01-01), Matsumoto et al.
Watson--"Full Semiconductor Water Package" vol. 18, No. 3, Aug. 1975, p. 642.
Nihei et al., "Semiconductor Handbook", pp. 128, 136, 277, published by Science Forum K. K., 1986, Sep. 25.
Honda et al., "High Density Packaging Handbook", pp. 238, 307, 240, 1986.

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