Connecting structure of circuit board and method for...

Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – With provision to conduct electricity from panel circuit to...

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

Reexamination Certificate

active

11175448

ABSTRACT:
First circuit board10including first resin base material12which is softened by heating and has a fusing property, and a plurality of first conductor patterns14formed on a surface of first resin base material12, and second circuit board20on which a plurality of second conductor patterns24are formed with the same pitch as that of first conductor patterns14are provided. In the configuration, first conductor patterns14and second conductor patterns24are brought into mechanical contact with each other to provide electrical conduction; first resin base material12covers first conductor patterns14and second conductor patterns24and is bonded to second resin base material22of second circuit board20, thereby connecting first circuit board10and second circuit board20to each other.

REFERENCES:
patent: 4818728 (1989-04-01), Rai et al.
patent: 5046238 (1991-09-01), Daigle et al.
patent: 5274912 (1994-01-01), Olenick et al.
patent: 6812412 (2004-11-01), Obata et al.
patent: 6824857 (2004-11-01), Lochun et al.
patent: 6971167 (2005-12-01), Nishikawa et al.
patent: 7-074446 (1995-03-01), None

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Connecting structure of circuit board and method for... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Connecting structure of circuit board and method for..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Connecting structure of circuit board and method for... will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3820775

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.