Connecting structure for electronic part and method of manufactu

Details Connecting structure for electronic part and method of manufactu Connecting structure for electronic part and method of manufactu

1988-01-13

1990-01-09

Hille, Rolf

357 80, 357 81, 357 68, H01L 2336, H01L 2348, H01L 21603

Patent

active

048931721

ABSTRACT:
Disclosed is a connecting structure for electrically connecting an electronic part such as an LSI chip to a substrate and a method of manufacturing the same. The present invention is suitable especially for electrical connection between a plurality of chips and a substrate which is required to have a function of absorbing a difference in thermal expansion in the horizontal direction and to deform in the vertical direction, and characterized in that a conductive flat spring having a height not more than the minimum length in the lateral direction is provided between the electronic part such as a chip and a wires substrate.

REFERENCES:
patent: 4607276 (1986-08-01), Butt
"Full Semiconductor Wafer Package"--Watson--IBM Technical Disclosure Bulletin--vol. 18, No. 3, Aug. 1975, p. 642.

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