Connecting socket for a semiconductor package

Details Connecting socket for a semiconductor package Connecting socket for a semiconductor package

1996-05-14

1998-04-28

Picard, Leo P.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

361767, 361803, 361820, 439 86, 439 91, 439591, H01L 2700

Patent

active

057453462

ABSTRACT:
Proposed is a connecting socket used for electric connection between electrode terminals of a semiconductor package and electrode terminals of a circuit board by being interposed therebetween. The socket is an assembly consisting of a base body in the form of a frame made from an insulating material, in which a semiconductor package is put and secured in the position, and an anisotropically electroconductive elastic sheet member bonded to the bottom surface of the base body. When the socket holding the semiconductor package is mounted on a circuit board, electric conduction is established between the electrode terminals of the semiconductor package and the electrode terminals of the circuit board through the anisotropically electroconductive elastic sheet member.

REFERENCES:
patent: 4766371 (1988-08-01), Moriya
patent: 5104327 (1992-04-01), Walburn
patent: 5140405 (1992-08-01), King et al.
patent: 5163837 (1992-11-01), Rowlette, Sr.

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