Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Patent
1994-04-28
1997-04-01
Echols, P. W.
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
29830, 361790, 361803, H05K 111
Patent
active
056173008
ABSTRACT:
When connecting a second printed substrate 3 with a first printed substrate 2, a plurality of first connection patterns 4s, 4b, for example, including through holes 2h are provided on the first printed substrate 2, a plurality of second connection patterns 5a, 5b facing the first connection patterns 4a, 4b are provided on an under surface 3d of the second printed substrate 3, and the first connection patterns 4a and the second connection patterns 5a are soldered using a reflow system or a flow system, thereby providing simplification, miniaturization, and reduction of cost together with noise reduction, lower loss, and high reliability.
REFERENCES:
patent: 3795047 (1974-03-01), Abolafia et al.
patent: 3867759 (1975-02-01), Siefker
patent: 4640010 (1987-02-01), Brown
patent: 4788766 (1988-12-01), Burger et al.
patent: 5031308 (1991-07-01), Yamashita
patent: 5142775 (1992-09-01), Wiley
patent: 5435057 (1995-07-01), Binora et al.
"AMP Interconnecting ideas," pp. 249 and 250 of the catalog, Revision, Dec., 1989.
"ITT Cannon .25 Connectors," May, 1989, pp. 1-12.
Anzawa Seiichi
Yoda Syoichi
Echols P. W.
Nagano Japan Radio Co. Ltd.
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