Connecting member of a circuit substrate and method of manufactu

Details Connecting member of a circuit substrate and method of manufactu Connecting member of a circuit substrate and method of manufactu

1994-09-20

1996-01-16

Ryan, Patrick J.

Stock material or miscellaneous articles

Structurally defined web or sheet

Discontinuous or differential coating, impregnation or bond

428901, 4283202, 4283213, 361748, 361750, B32B 900

Patent

active

054846471

ABSTRACT:
A connecting member of circuit substrates includes an organic porous base material provided with tackfree films on both sides, through-holes disposed at requested places which are filled with conductive resin compound up to the surface of the tackfree films. This structure enables inner-via-hole connection and can therefore attain a connecting member of circuit substrates and an electrical connector of high reliability and high quality.
By using a connecting member of circuit substrates including the organic porous base material provided with tackfree films on both sides and through-holes disposed at requested places which are filled with conductive resin compound up to the surface of the tackfree films, it is possible to form a high-multilayer substrate easily from double sided boards or four-layer substrates which can be manufactured rather stably. In addition to that, since the conductive paste is filled up to the surface of the tackfree films, the conductive paste sticks out from the surface of the organic porous base material when the tackfree-films are separated. As a result, the filled amount of the conductive substance increases after the lamination, and thus, the connection resistance is reduced considerably.

REFERENCES:
patent: 5346750 (1994-09-01), Hatakeyama
Patent Abstracts of Japan, vol. 13, No. 230 (May 26, 1989).
Patent Abstracts of Japan, vol. 15, No. 506 ((Dec. 20, 1991).
Patent Abstracts of Japan, vol. 17, No. 583 (Oct. 22, 1993).
Patent Abstracts of Japan, vol. 13, No. 413 (Sep. 12, 1989).

Affiliated with

Also associated with

Rating

Connecting member of a circuit substrate and method of manufactu does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Connecting member of a circuit substrate and method of manufactu, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Connecting member of a circuit substrate and method of manufactu will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-308213