Connecting member for surface mounting circuit

Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – Distinct contact secured to panel circuit

Reexamination Certificate

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C439S091000, C439S591000

Reexamination Certificate

active

07452217

ABSTRACT:
A circuit pattern is formed on a printed circuit board, and a plating surface of a projecting stripe on a substrate is connected to the circuit pattern by soldering. Further, adhesive agent is filled in a gap between a coarsened surface of a non-circuit unit and the printed circuit board. When the adhesive agent is filled in the gap, the adhesive agent comes in an uneven portion of the coarsened non-circuit unit and is hardened in the recessed portion, so that a chemical bonding force of the adhesive agent itself and an anchoring effect act. For this reason, a fixing force and the bonding force increase.

REFERENCES:
patent: 5045249 (1991-09-01), Jin et al.
patent: 5586892 (1996-12-01), Sato
patent: 5819406 (1998-10-01), Yoshizawa et al.
patent: 6265673 (2001-07-01), Higashida et al.
patent: 6331119 (2001-12-01), Bernier et al.
patent: 6332786 (2001-12-01), Suga et al.
patent: 6407345 (2002-06-01), Hirose et al.
patent: 6592783 (2003-07-01), Kumakura et al.
patent: 7134879 (2006-11-01), Sugimoto et al.
patent: 7258549 (2007-08-01), Asahi et al.
patent: 5-006789 (1993-01-01), None
patent: 5-304356 (1993-11-01), None
patent: 8-138773 (1996-05-01), None

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