Connecting member and a connecting method with ball and tapered

Details Connecting member and a connecting method with ball and tapered Connecting member and a connecting method with ball and tapered

1995-07-24

2000-07-11

Sough, Hyung-Sub

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

438613, 361768, 361779, 257780, 22818022, H01R 909

Patent

active

060875976

ABSTRACT:
An electronic device assembly (and method for forming the same) including a first substrate having a first surface, a second surface, and a first pad on the first surface thereof; a second substrate having a first surface, a second surface, and a second pad on the second surface thereof, the first pad facing the second pad; a rigid spherical core interposed between the first and second pads; and solder connecting the first and second pads. The first substrate has a through-hole which is provided through the first substrate at a position of the first pad, at least a part of the solder is positioned in the through-hole and at least a part of the spherical core is received in the through-hole. The through-hole has an inner wall which is continuously tapered from the first surface of the first substrate to the second surface of the first substrate.

REFERENCES:
patent: 3148310 (1964-09-01), Feldman
patent: 4987100 (1991-01-01), McBride et al.
patent: 5048744 (1991-09-01), Chang et al.
patent: 5203075 (1993-04-01), Angulas et al.
patent: 5261155 (1993-11-01), Angulas et al.
patent: 5303862 (1994-04-01), Bross et al.
patent: 5401911 (1995-03-01), Anderson et al.
patent: 5448114 (1995-09-01), Kondoh et al.
patent: 5844316 (1998-12-01), Mallik et al.

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