Connecting device for connecting a semiconductor chip to a condu

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

257779, 257780, 257786, H01L 2348, H01L 2352, H01L 2940

Patent

active

058380671

ABSTRACT:
A connecting device, and corresponding method, for connecting a semiconductor chip/chip and a conductor, the connecting device including: a pad formed on the chip; a passivation layer formed around the pad thereby defining an aperture in the passivation layer; a pad-to-bump connecting layer at least in the aperture; and a bump, formed on the pad-to-bump connecting layer, not extending laterally outside of the aperture. The passivation layer is also formed on an edge area of the pad so as to define shoulder portions between which the aperture is located. The pad-to-bump connecting layer includes: a first base layer formed in the aperture and also on the shoulder portions of the passivation layer so that the first base layer extends laterally outside the aperture; and a second base layer formed at least in the aperture. The cross-sectional area of the bump is less than the cross-sectional area of the aperture.

REFERENCES:
patent: 3585461 (1971-06-01), Eynon et al.
patent: 4742023 (1988-05-01), Hasegawa
patent: 4787958 (1988-11-01), Lytle
patent: 5010389 (1991-04-01), Gansauge et al.
patent: 5293071 (1994-03-01), Erdos
patent: 5376584 (1994-12-01), Agarwala
patent: 5631499 (1997-05-01), Hosomi et al.
Liquid Crystal Flat Panel Displays Manufacturing Science & Technology Chapter Two: Display Manufacturing, William C. O'Mara, pp. 93, 94-97, Chapter three: Product Materials, pp. 149-153, Chapter Four: Manufacturing Equipment, p. 198.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Connecting device for connecting a semiconductor chip to a condu does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Connecting device for connecting a semiconductor chip to a condu, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Connecting device for connecting a semiconductor chip to a condu will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-887154

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.