Connecting board for connection between base plate and mounting

Metal founding – Process – Shaping liquid metal against a forming surface

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

164 98, 228 563, 22818022, 228246, B22D 2306, B23K 3514

Patent

active

06148900&

ABSTRACT:
A connecting board is provided for disposition between a base plate such a LGA base plate and a mounting board such as a printed circuit board. The connecting board has a substrate having a plurality of through holes. Each through hole extends between opposite first and second surfaces of the substrate. An easily deformable soft metal body is mounted in each through hole in such a way as to have protruded portions protruding from the first and second surfaces of the substrate. The protruded portions of the soft metal body are different in protruding height. The connecting board are connected at the protruded portions to the base plate and the mounting board. The heights of the protruded portions are set depending upon the materials and the coefficients of thermal expansion of the LGA base plate, printed circuit board and connecting board. By making the protruding heights of the protruded portions different from each other, the distance between the LGA base plate and the connecting board and the distance between the connecting board and the printed circuit board are set desiredly.

REFERENCES:
patent: 4412642 (1983-11-01), Fisher
patent: 4830264 (1989-05-01), Bitaillou et al.
patent: 4878611 (1989-11-01), Lovasco et al.
patent: 4914814 (1990-04-01), Behun et al.
patent: 5060844 (1991-10-01), Behun et al.
patent: 5071359 (1991-12-01), Arnio et al.
patent: 5174766 (1992-12-01), Yoshizawa et al.
patent: 5340947 (1994-08-01), Credle et al.
patent: 5388327 (1995-02-01), Trabucco
patent: 5456004 (1995-10-01), Swamy
patent: 5509203 (1996-04-01), Yamashita
patent: 5512786 (1996-04-01), Imamura et al.
patent: 5531021 (1996-07-01), Kolman et al.
patent: 5624268 (1997-04-01), Maeda et al.
patent: 5656798 (1997-08-01), Kubo et al.
Michifumi; "Mounting Method For Electronic Circuit Device"; Patent Abstracts of Japan; Publication No. 06 268141; Publication Date: Sep. 22, 1994; vol. 18, No. 673; (Dec. 19, 1994).
Yasuo; "Mounting of Electric Circuit Component"; Patent Abstracts of Japan; Publication No. 03 192793; Publication Date: Aug. 22, 1991; vol. 15, No. 453; (Nov. 18, 1991).
Nobuhiko; "Semiconductor Device and Manufacture Thereof"; Patent Abstracts of Japan; Publication No. 58 035935; Publication Date: Mar. 2, 1983; vol. 7, No. 115; (May 19, 1983).
Kozo; "Formation of Metal Via on Silicon Substrate and Fabrication of Multi Chip Module"; Patent Abstracts of Japan; Publication No. 05 198697; Publication Date: Aug. 6, 1996; vol. 17, No. 625; Nov. 18. 1993.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Connecting board for connection between base plate and mounting does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Connecting board for connection between base plate and mounting , we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Connecting board for connection between base plate and mounting will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-1248971

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.