Metal founding – Process – Shaping liquid metal against a forming surface
Patent
1998-10-30
2000-11-21
Lin, Kuang Y.
Metal founding
Process
Shaping liquid metal against a forming surface
164 98, 228 563, 22818022, 228246, B22D 2306, B23K 3514
Patent
active
06148900&
ABSTRACT:
A connecting board is provided for disposition between a base plate such a LGA base plate and a mounting board such as a printed circuit board. The connecting board has a substrate having a plurality of through holes. Each through hole extends between opposite first and second surfaces of the substrate. An easily deformable soft metal body is mounted in each through hole in such a way as to have protruded portions protruding from the first and second surfaces of the substrate. The protruded portions of the soft metal body are different in protruding height. The connecting board are connected at the protruded portions to the base plate and the mounting board. The heights of the protruded portions are set depending upon the materials and the coefficients of thermal expansion of the LGA base plate, printed circuit board and connecting board. By making the protruding heights of the protruded portions different from each other, the distance between the LGA base plate and the connecting board and the distance between the connecting board and the printed circuit board are set desiredly.
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Saiki Hajime
Yamasaki Kozo
Lin Kuang Y.
NGK Spark Plug Co. Ltd.
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