Connecting arrangement and process for connecting two separate p

Details Connecting arrangement and process for connecting two separate p Connecting arrangement and process for connecting two separate p

1996-09-11

1999-12-21

Stright, Ronald

Surgery

Means for introducing or removing material from body for...

Treating material introduced into or removed from body...

604905, 604534, 428375, 428376, 428398, 428407, A61M 2500, D02G 300

Patent

active

060043113

ABSTRACT:
A connecting arrangement for a medical system, having a first part including a plastic material that is dimensionally stable at a heat-treatment temperature and a second part including a plastic material that is not dimensionally stable at the heat-treatment temperature and thus tends to flow under a compressive force; in which the plastic materials do not contain any PVC or EVA. The connection is made by bringing the surfaces on the first and second parts together with subsequent heat-treatment under a compressive force, wherein the second plastic material tends to flow under the simultaneous effects of temperature and compressive force.

REFERENCES:
patent: 3143364 (1964-08-01), Klein
patent: 3476408 (1969-11-01), Wolfe
patent: 3942529 (1976-03-01), Waage
patent: 4211741 (1980-07-01), Ostoich
patent: 4251310 (1981-02-01), Goldhaber et al.
patent: 4289337 (1981-09-01), Roe
patent: 4352702 (1982-10-01), Bornstein
patent: 4516977 (1985-05-01), Herbert
patent: 5284184 (1994-02-01), Noone et al.
patent: 5356709 (1994-10-01), Woo et al.
patent: 5626930 (1997-05-01), Fukushi

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