Connecting apparatus

Details Connecting apparatus Connecting apparatus

1990-02-22

1991-05-21

Nimmo, Morris H.

Electricity: conductors and insulators

Conduits, cables or conductors

Combined

174260, 174261, 228198, 361404, 428642, 439886, H01R 400

Patent

active

050177389

ABSTRACT:
A connecting apparatus wherein a porous silver plating layers are provided on surface pads of a printed circuit board and on a surface of a contact provided on the pads of a mother board. The plating layers are respectively impregnated with tin-zinc alloy and gallium. The electrical connection is established between the pads of the printed circuit board and the pads of the mother board through a liquid alloy by placing the plating layers in contact with each other. For the first printed circuit board having the pads and spacer, the gallium particles are adhered to the pads, while solder is temporarily adhered to the spacer. For the second printed circuit board having the pads and the connecting pads, tin or indium layer is provided on the surface of the pads, then the spacer of the first printed circuit board is positioned and fixed to the connecting pad of the second printed circuit board. Thus, electrical connection can be formed by way of the contact of gallium-tin or gallium-indium liquid alloy between the pads of both the printed circuit boards.

REFERENCES:
patent: 3622944 (1971-11-01), Tsuchiya
patent: 4538876 (1985-09-01), Hall et al.

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