Conformation of vacuum - laminated solder mask coated printed ci

Details Conformation of vacuum - laminated solder mask coated printed ci Conformation of vacuum - laminated solder mask coated printed ci

1988-12-23

1990-05-22

Michl, Paul R.

Radiation imagery chemistry: process, composition, or product th

Stripping process or element

430270, 430935, 156 87, 156286, 156285, 156382, 156381, G03C 174

Patent

active

049277332

ABSTRACT:
A method is disclosed of obtaining a void free interface between a photosensitive dry film and substrate by applying uniform fluid pressure after vacuum lamination.

REFERENCES:
patent: 4127436 (1978-11-01), Friel

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