Conformal wafer chuck for plasma processing having a non-planar

Details Conformal wafer chuck for plasma processing having a non-planar Conformal wafer chuck for plasma processing having a non-planar

1991-09-17

1993-11-30

Hearn, Brian E.

Fishing, trapping, and vermin destroying

437228, 156643, 118620, 118728, H01L 2100, H01L 2102, H01L 21302, H01L 21463

Patent

active

052665275

ABSTRACT:
A method of processing a semiconductor wafer using a wafer chuck having a first end with a non-planar surface, the non-planar surface shaped such that a wafer supported at a plurality of points about its periphery will have a uniform pressure between its surface and the non-planar surface, and pressing a surface of the wafer against the non-planar surface of the wafer chuck.

REFERENCES:
patent: 4685999 (1987-08-01), Davis et al.

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