Conformal thermal interface material for electronic components

Details Conformal thermal interface material for electronic components Conformal thermal interface material for electronic components

1997-02-14

2000-04-25

Thibodeau, Paul

Stock material or miscellaneous articles

Layer or component removable to expose adhesive

Wax containing

428 413, 428 418, 428220, 428348, 428349, 428515, 156247, 1563066, 1563244, 165185, 252 74, 361700, 361713, 361704, 257714, 524399, 524400, 524404, 524428, 524489, 525220, 525240, C09K 500

Patent

active

060541989

ABSTRACT:
A thermally-conductive interface for conductively cooling a heat-generating electronic component having an associated thermal dissipation member such as a heat sink. The interface is formed as a self-supporting layer of a thermally-conductive material which is form-stable at normal room temperature in a first phase and substantially conformable in a second phase to the interface surfaces of the electronic component and thermal dissipation member. The material has a transition temperature from the first phase to the second phase which is within the operating temperature range of the electronic component.

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