Conformal heat sink for electronic module

Details Conformal heat sink for electronic module Conformal heat sink for electronic module

1993-04-28

1994-05-24

Thompson, Gregory D.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

174252, H05K 720

Patent

active

053154800

ABSTRACT:
A system for cooling an electronic module in a computer system. In one embodiment of the invention, predetermined areas of the module, such as those exposed parts that carry electrical currents are covered with an conformable, electrically insulating layer. Thereafter, a second conformable, thermally conductive layer is formed on the first layer. In addition, surface expanding elements may be arranged on the first layer near devices particularly sensitive to heat before the application of the second layer.

REFERENCES:
patent: 3179854 (1965-04-01), Luedicke et al.
patent: 4999741 (1991-03-01), Tyler
patent: 5045972 (1991-09-01), Supan et al.
patent: 5097387 (1992-03-01), Griffith
patent: 5166864 (1992-11-01), Chitwood et al.
Arnold et al, "Construction of a Liquid Metal Filled Module", IBM Tech Disc. Dul. vol. 22, No. 2, Jul. 1979, pp. 602-605.

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