Conformal diamond coating for thermal improvement of electronic

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

257 77, 257788, 257789, 257741, 257706, 257701, 257738, 257796, 257712, 251104, H01L 2310, H01L 2328

Patent

active

059071893

ABSTRACT:
One aspect of the invention relates to a method for providing a semiconductor package with a thermally conductive coating, the semiconductor package including a package substrate having a plurality of electrically conductive traces formed thereon, an upper surface and a lower surface, the lower surface having a plurality of contacts for providing electrical connection between the conductive traces formed on the package substrate and a plurality of conductive traces formed on a printed circuit board, and a semiconductor die mounted to the upper surface to the package substrate, the semiconductor die having a plurality of bond pads formed thereon which are electrically connected to the conductive traces formed on the package substrate. In one embodiment, the method includes the steps of depositing a coating on the upper surface of the package substrate and the coating includes a diamond film or diamond particles.

REFERENCES:
patent: 5218215 (1993-06-01), Liang et al.
patent: 5608267 (1997-03-01), Mahulikar et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Conformal diamond coating for thermal improvement of electronic does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Conformal diamond coating for thermal improvement of electronic , we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Conformal diamond coating for thermal improvement of electronic will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-402760

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.