Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated
Patent
1997-05-29
1999-05-25
Williams, Alexander Oscar
Active solid-state devices (e.g., transistors, solid-state diode
Encapsulated
257 77, 257788, 257789, 257741, 257706, 257701, 257738, 257796, 257712, 251104, H01L 2310, H01L 2328
Patent
active
059071893
ABSTRACT:
One aspect of the invention relates to a method for providing a semiconductor package with a thermally conductive coating, the semiconductor package including a package substrate having a plurality of electrically conductive traces formed thereon, an upper surface and a lower surface, the lower surface having a plurality of contacts for providing electrical connection between the conductive traces formed on the package substrate and a plurality of conductive traces formed on a printed circuit board, and a semiconductor die mounted to the upper surface to the package substrate, the semiconductor die having a plurality of bond pads formed thereon which are electrically connected to the conductive traces formed on the package substrate. In one embodiment, the method includes the steps of depositing a coating on the upper surface of the package substrate and the coating includes a diamond film or diamond particles.
REFERENCES:
patent: 5218215 (1993-06-01), Liang et al.
patent: 5608267 (1997-03-01), Mahulikar et al.
LSI Logic Corporation
Williams Alexander Oscar
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