Conformable pad with thermally conductive additive for heat diss

Details Conformable pad with thermally conductive additive for heat diss Conformable pad with thermally conductive additive for heat diss

1990-06-06

1991-10-22

Picard, Leo P.

Electricity: electrical systems and devices

Electrostatic capacitors

Fixed capacitor

361386, 361388, 361424, 165185, H05K 720

Patent

active

050601148

ABSTRACT:
A conformable, gel-like pad, preferably of silicone, with a thermally conductive additive conducts heat away from a packaged electronic power device with which it is in contact. Formed by adding particles of a thermally conductive material such as aluminum powder, nickel, aluminum oxide, iron oxide, beryllium oxide, silver, etc., to a mixture of silicone resins and curing agents poured into a mold, the molded pad can be formed to accommodate virtually any geometry and size of electronic component to provide a custom-fit at little cost. A thin, solid sheet of a thermally conductive metal such as aluminum positioned in contact with a surface of the conformable pad further increases heat removal. Another embodiment contemplates a metallic foil disposed in contact with a surface of or within the conformable pad and extending therefrom which can be coupled to a heat sink or to neutral ground potential for radiation shielding. A metallic radiation shield box may be used as a mold for forming the conformable pad and to form a combination EMI/RFI radiation shield and heat transfer device for an electronic component disposed within the box and in contact with the conformable pad.

REFERENCES:
patent: 4029999 (1977-06-01), Neumann et al.
patent: 4654754 (1987-03-01), Daszkowski
patent: 4747019 (1988-05-01), Ito et al.
patent: 4886700 (1989-12-01), Younes
patent: 4914143 (1990-04-01), Patel
patent: 4926291 (1990-05-01), Sarraf
patent: 4959752 (1990-09-01), Samarov et al.

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