Confined water fixture for holding wafers undergoing chemical-me

Details Confined water fixture for holding wafers undergoing chemical-me Confined water fixture for holding wafers undergoing chemical-me

1992-05-27

1993-12-07

Kisliuk, Bruce M.

Abrasive tool making process, material, or composition

Impregnating or coating an abrasive tool

51237R, 51216T, 51283R, B24B 4106

Patent

active

052674185

ABSTRACT:
A wafer polishing fixture is disclosed containing a first liquid film confined by a non-porous but flexible enclosure for distributing evenly the applied polishing forces across the surface of a wafer supported by the confined liquid. The fixture comprises a flexible, non-porous template with a pocket for receiving a wafer to be polished. A washer is placed between a carrier and the template pocket. A film of water fills the bottom of the pocket and is confined with the aid of the washer and by an overlying porous pad extending across the pocket and having a non-porous sheath facing the liquid. A second liquid film saturates and covers the upper surface of the pad. The wafer to be polished floats upon the second liquid film within the pocket.

REFERENCES:
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patent: 3518798 (1970-07-01), Boettcher
patent: 3977130 (1976-08-01), Degner
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patent: 4239567 (1980-12-01), Winings
patent: 4313284 (1982-02-01), Walsh
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patent: 4521995 (1985-06-01), Sekiya
patent: 4625463 (1986-12-01), Sekiya
patent: 4925518 (1990-05-01), Wasserman et al.
patent: 5101602 (1992-04-01), Hashimoto
patent: 5191738 (1993-03-01), Nakazato

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