Special receptacle or package – For plate or sheet – Fragile or sensitive
Reexamination Certificate
2005-12-06
2005-12-06
Bui, Luan K. (Department: 3728)
Special receptacle or package
For plate or sheet
Fragile or sensitive
C206S449000, C053S460000, C053S473000
Reexamination Certificate
active
06971519
ABSTRACT:
A configuration of a flat carrier with a chip module in a padded envelope, which can be transported in a transport device in the direction of one of the envelope's side edges, includes disposing the chip module in the padded envelope such that wire connections in the chip module extend over a side of the semiconductor chip that runs parallel to the transport device. Such a configuration is made possible by the fact that the flat carrier is applied in a standard way to a further carrier, which is folded in a suitable way.
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Bui Luan K.
Infineon - Technologies AG
Locher Ralph E.
LandOfFree
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