Configuration and method for manufacturing compact high...

Details Configuration and method for manufacturing compact high... Configuration and method for manufacturing compact high...

2005-04-12

2005-04-12

Barrera, Ramon M. (Department: 2832)

Inductor devices

Coils of special configuration

Planar type

C336S096000

Reexamination Certificate

active

06879238

ABSTRACT:
This invention discloses a method for manufacturing an inductor by first press punching a first and a second layer of conductive plates into a first and second coil layers with a first and second inductor lead layers as single integrated layers. The manufacturing process further includes a step of overlapping and connecting the first and second coil layers to form an inductor. In a preferred embodiment, process of manufacturing further includes a step of mixing epoxy to bond with a highly magnetic material and pressure molding the bonding magnetic material around the coil layers to form an inductor.

REFERENCES:
patent: 4223360 (1980-09-01), Sansom et al.
patent: 6317965 (2001-11-01), Okamoto et al.
patent: 6438000 (2002-08-01), Okamoto et al.
patent: 6774757 (2004-08-01), Fujiyoshi et al.

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