Configuration and method for making contact with the back...

Details Configuration and method for making contact with the back... Configuration and method for making contact with the back...

2005-03-08

2005-03-08

Nelms, David (Department: 2818)

Adhesive bonding and miscellaneous chemical manufacture

Differential fluid etching apparatus

For liquid etchant

C156S345420, C156S345190, C257S181000, C257S414000, C257S703000, C438S107000, C438S421000, C438S746000

Reexamination Certificate

active

06863769

ABSTRACT:
A base body is provided, on which a first sealing ring and a second sealing ring are disposed. A substrate is disposed on the sealing rings in such a way that a cavity is formed between the first sealing ring, the second sealing ring, the base body and the substrate. An etching substance can be introduced into the cavity in order to etch clear a conductive layer that has been applied to the substrate. When a conductive layer that has been applied to the substrate back surface has been uncovered, an electrolyte can be introduced into the cavity, making contact with the conductive layer and therefore the substrate back surface.

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